Paper-Conference

Scenario-based design flow for mapping streaming applications onto on-chip many-core systems
The next generation of embedded software has high performance requirements and is increasingly dynamic. Multiple applications are …
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Worst-case temperature guarantees for real-time applications on multi-core systems
Due to increased on-chip power density, multi-core systems face various thermal issues. In particular, exceeding a certain threshold …
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Fast worst-case peak temperature evaluation for real-time applications on multi-core systems
The reliability of multi-core systems is nowadays threatened by high chip temperatures leading to long-term reliability concerns and …
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DAL: Programming Efficient and Fault-Tolerant Applications for Many-Core Systems
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PRO3D, programming for future 3D manycore architectures: Project’s interim status
PRO3D tackles two important 3D technologies, that are Through Silicon Via (TSV) and liquid cooling, and investigates their consequences …
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Thermal-aware task assignment for real-time applications on multi-core systems
The reduced feature size of electronic systems and the demand for high performance lead to increased power densities and high chip …
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Worst-case temperature analysis for different resource availabilities: a case study
With three-dimensional chip integration, the heat dissipation per unit area increases rapidly and may result in high on-chip …
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Thermal-aware system analysis and software synthesis for embedded multi-processors
Nowadays, the reliability and performance of modern embedded multi-processor systems is threaten by the ever-increasing power densities …
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Worst-case temperature analysis for real-time systems
With the evolution of today’s semiconductor technology, chip temperature increases rapidly mainly due to the growth in power …
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A timed HW/SW coemulation technique for fast yet accurate system verification
In system-on-chip (SoC) design, it is essential to verify the correctness of design before a chip is fabricated. While conventional …
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